公開論文

發表年份 論文題目 期刊名稱 作者
No.1
2012
Thermal-Stability of Grain Structure and Material Properties in an Annealing Twinned Ag-8Au-3Pd Allo Scripta Mater., 67, (2012) 605-608. T.H.Chuang, H.C. Wang, C.H. Tsai, C.C. Chang, C.H. Chuang, J.D. Lee, and H.H. Tsai,
No.2
2012
Effects of Annealing Twins on the Grain Growth and Mechanical Properties of Ag-8Au-3Pd Bonding Wires J. Electron. Mater., 41, 11, (2012) 3215-3222. T.H.Chuang, C.H. Tsai, H.C. Wang, C.C. Chang, C.H. Chuang, J.D. Lee, and H.H. Tsai,
No.3
2012
21世紀封裝導線的新材料-銀金鈀合金線 電子月刊,18(2012)180-192. 李俊德、蔡幸樺、蔡志欣、莊東漢
No.4
2012
次世代LED銲線技術發展趨勢與現況 機械工業雜誌,354(2012)88-101).. 莊東漢、蔡志欣、李俊德、蔡幸樺、蔡志欣
No.5
2013
An innovative Annealing-Twinned Ag-Au-Pd Bonding Wire for IC and LED packaging 2012 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 H.H. Tsai, J.D. Lee, C.H.Tsai, H.C. Wang, C.C. Chang, and T.H. Chuang
No.6
2013
Formation and Growth of Intermetallics in an Annealing Twinned Ag-8Au-3Pd Wire Bonding Package durin IEEE Trans. Compon. Packag. Manufact. Technolog., 3, 1, (2013) 3-9. T.H.Chuang, C.C. Chang, C.H. Chuang, J.D. Lee, and H.H. Tsai,
No.7
2013
Effect of Annealing Twins on Electromigration in Ag-8Au-3Pd Bonding Wires J. Electron. Mater., 42, 3, (2013) 454-551. T.H.Chuang, H.C. Wang, C.H. Chuang, J.D. Lee, and H.H. Tsai,
No.8
2013
Surface Reconstruction of an Annealing Twinned Ag-8Au-3Pd alloy Wire under Current Stressing Metall. Mater. Trans., 44A, (2013) 5106-5112. T.H.Chuang, H.C. Wang, C.H. Chuang, H.J. Lin, J.D. Lee, and H.H. Tsai,
No.9
2014
Thermal Stability of Grain Structure and Material Properties in an Annealing Twinned Ag-4Pd Alloy Wi J. Alloy Compound, 615, (2014) 891-898. T.H. Chuang, H.J. Lin, C.H. Chuang, Y.Y. Shiue, F.S. Shieu, Y.L. Huang, P.C. Hsu, J.D. Lee, and H.H. Tsai
No.10
2014
Durability to Electromigration of an Annealing-Twinned Ag-4Pd Alloy Wire Under Current Stressing Metallurgical and Materials Transactions A, 2014. 45(12): p. 5574-5583. Tung-Han Chuang, Hsin-Jung Lin, Chien-Hsun Chuang, Chih-Hsin Tsai, Jun-Der Lee, and Hsing-Hua Tsai
No.11
2014
銀合金焊球凸塊覆晶組裝及其應用 電子月刊, 231(2014)158-169. 莊東漢、蔡幸樺、李俊德、張永和、施昱廷
No.12
2014
High Performance Ag-Pd alloy Wires for High Frequency IC Packages 2013 International Microsystems, Packaging, Assembly andCircuits Technology Conference, IMPACT 2013, H.H. Tsai, T.H. Chuang, J.D. Lee, C.H.Tsai, H.C. Wang, H.J. Lin, and C.C.Chang
No.13
2014
Applications of Ag-alloy Stud Bump for IC and LED Packages IMPACT-EMAP 2014 Joint Conference P.176-P.179 Hsing-Hua Tsaia, Chih-Hsin Tsai, Jun-Der Lee, Dennis Chang, Yu-Ting Shih , Chun-Hao Chen and Tung-Han Chuang,
No.14
2015
Mechanism of Electromigration in Ag-Alloy Bonding Wires J. Electron. Mater., 44, 2, (2015) 623-629. Tung-Han Chuang, Hsin-Jung Lin, Hsi-Ching Wang, Chien-Hsun Chuang, and Chih-Hsin Tsai
No.15
2016
Inhibition of Silver Electrolytic Migration in Ag-alloy Bonding Wires Materials Science Forum, 863, (2016) 95-101. Chien-Hsun Chuang, Yan-Cheng Lin, Yu-Zhen He, Chih-Hsin Tsai, Jun-Der Lee, Shang-Chih Wang and Hsing-Hua Tsai
No.16
2016
Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages IEEE-TCPMT 6,2, (2016) 298-305. Chih-Hsin Tsai, Chien-Hsun Chuang, Hsing-Hua Tsai, Jun-Der Lee,Dennis Chang, Hsin-Jung Lin, and Tung-Han Chuang
No.17
2016
Low Temperature Bonding of Pd/Ni Assembly for Hydrogen Purifier World Congress on Mechanical, Chemical, and Material Engineering (MCM'16) Yan-Cheng Lin, Chien-Hsun Chuang, Hsing-Hua Tsai, and Tung-Han Chuang
No.18
2016
Effects of Current Stressing on the Grain Structure and Mechanical Properties of Ag-Alloy Bonding Wi Metals,6, (2016) 182. Chien-Hsun Chuang, Chih-Hsin Tsai, Yan-Cheng Lin and Hsin-Jung Lin
No.19
2018
Evaluation of Corrosion Resistance of Ag-Alloy Bonding Wires for Electronic Packaging IEEE-TCPMT 8,1, (2018) 146-153. Chun-Hao Chen, Yan-Cheng Lin, Yu-Ting Shih, Sheng-Chi Chen, Chih-Hsin Tsai, Shang-Chih Wang, and Tung-Han Chuang
No.20
2018
Electrolytic Migration of Ag-Pd Alloy Wires with Various Pd Contents J. Electron. Mater., 47, 7, (2018) 3634-3638. Yan-Cheng Lin, Chun-Hao Chen, Yu-Zhen He, Sheng-Chi Chen, and Tung-Han Chuang
No.21
2019
Effect of alloying Au on the microstructural, mechanical and electrical properties of Ag‑based alloy Journal of Materials Science: Materials in Electronics (2019) 30:9396–9409 Bing-Hau Kuo, Du-Cheng Tsai, Yen-Lin Huang, Po-Chun Hsu, Tung-Han Chuang, Jun-Der Lee, Hsing-Hua Tsai and Fuh-Sheng Shieu
No.22
2019
Cu/Al Clad and Ag-4Pd Ribbon Bonding for High Power IC Packages Sensors & Transducers, Vol. 235, Issue 7, July 2019, pp. 37-42 Chun-Hao Chen, Jan Hoefer, Yen-Cheng Lin, Chia-Ying Lin and Tung-Han Chuang
No.23
2020
Ultrasonic Bonding of Ag and Ag-alloy Ribbon an innovative alternative for High Power IC Packages IEEE Trans. Compon., Packag., Manuf. Technol., 10, 6, 1061-1068, 2020. Chun-Hao Chen, Yan-Cheng Lin, Anne Groth, Yu-Chang Lai, Chia-Ying Lin, Heng-Ming Chang, Tung-Han Chuang

2012年01月:取得美國專利證書 證書號碼:US8,101,123B2/US8,101,030B2 
2012年10月:取得台灣專利證書 證書號碼:I373382 
2013年02月:取得台灣專利證書 證書號碼:I384082 
2013年03月:取得台灣專利證書 證書號碼:I394849、I395313、I396756 
2013年09月:榮獲台灣102年國家發明創作獎-合金線材及製造方法

 

公司願景及未來展望

臺灣高科技業因全球整體產業環境改變而步入高度競爭與微利之時代,為求企業永續經營,將持續利用現有優勢,提供半導體產業更優良的合 金線材,以因應企業生產成本現實之嚴峻挑戰,並期許結合全體員工向心力,以優質的服務、持續的創新、精粹的技術永續經營成為百年企業。

高品質與低成本的密秘武器

『合金線』主要由不同金屬組成,物理性質在斷裂荷重、斷裂伸長、焊線後拉力及推力均優於純金線,導電性及熔斷電流、導熱率均可媲美純金線,但價格卻大幅低於純金線。

規格齊全可量身訂做適合機種

本公司生產的合金線規格齊全,線徑2.0~0.6mil(0.0500-0.0150mm),且可量身訂做適合客戶的機種,擁有強而有力的研發團隊與生產線以及深厚的技術根基為後盾,絕對可滿足您生產品質與價格的需求。

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