| No.1 2012 | Thermal-Stability of Grain Structure and Material Properties in an Annealing Twinned Ag-8Au-3Pd Allo | Scripta Mater., 67, (2012) 605-608. | T.H.Chuang, H.C. Wang, C.H. Tsai, C.C. Chang, C.H. Chuang, J.D. Lee, and H.H. Tsai, |
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| No.2 2012 | Effects of Annealing Twins on the Grain Growth and Mechanical Properties of Ag-8Au-3Pd Bonding Wires | J. Electron. Mater., 41, 11, (2012) 3215-3222. | T.H.Chuang, C.H. Tsai, H.C. Wang, C.C. Chang, C.H. Chuang, J.D. Lee, and H.H. Tsai, |
| No.3 2012 | 21世紀封裝導線的新材料-銀金鈀合金線 | 電子月刊,18(2012)180-192. | 李俊德、蔡幸樺、蔡志欣、莊東漢 |
| No.4 2012 | 次世代LED銲線技術發展趨勢與現況 | 機械工業雜誌,354(2012)88-101).. | 莊東漢、蔡志欣、李俊德、蔡幸樺、蔡志欣 |
| No.5 2013 | An innovative Annealing-Twinned Ag-Au-Pd Bonding Wire for IC and LED packaging | 2012 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 | H.H. Tsai, J.D. Lee, C.H.Tsai, H.C. Wang, C.C. Chang, and T.H. Chuang |
| No.6 2013 | Formation and Growth of Intermetallics in an Annealing Twinned Ag-8Au-3Pd Wire Bonding Package durin | IEEE Trans. Compon. Packag. Manufact. Technolog., 3, 1, (2013) 3-9. | T.H.Chuang, C.C. Chang, C.H. Chuang, J.D. Lee, and H.H. Tsai, |
| No.7 2013 | Effect of Annealing Twins on Electromigration in Ag-8Au-3Pd Bonding Wires | J. Electron. Mater., 42, 3, (2013) 454-551. | T.H.Chuang, H.C. Wang, C.H. Chuang, J.D. Lee, and H.H. Tsai, |
| No.8 2013 | Surface Reconstruction of an Annealing Twinned Ag-8Au-3Pd alloy Wire under Current Stressing | Metall. Mater. Trans., 44A, (2013) 5106-5112. | T.H.Chuang, H.C. Wang, C.H. Chuang, H.J. Lin, J.D. Lee, and H.H. Tsai, |
| No.9 2014 | Thermal Stability of Grain Structure and Material Properties in an Annealing Twinned Ag-4Pd Alloy Wi | J. Alloy Compound, 615, (2014) 891-898. | T.H. Chuang, H.J. Lin, C.H. Chuang, Y.Y. Shiue, F.S. Shieu, Y.L. Huang, P.C. Hsu, J.D. Lee, and H.H. Tsai |
| No.10 2014 | Durability to Electromigration of an Annealing-Twinned Ag-4Pd Alloy Wire Under Current Stressing | Metallurgical and Materials Transactions A, 2014. 45(12): p. 5574-5583. | Tung-Han Chuang, Hsin-Jung Lin, Chien-Hsun Chuang, Chih-Hsin Tsai, Jun-Der Lee, and Hsing-Hua Tsai |
| No.11 2014 | 銀合金焊球凸塊覆晶組裝及其應用 | 電子月刊, 231(2014)158-169. | 莊東漢、蔡幸樺、李俊德、張永和、施昱廷 |
| No.12 2014 | High Performance Ag-Pd alloy Wires for High Frequency IC Packages | 2013 International Microsystems, Packaging, Assembly andCircuits Technology Conference, IMPACT 2013, | H.H. Tsai, T.H. Chuang, J.D. Lee, C.H.Tsai, H.C. Wang, H.J. Lin, and C.C.Chang |
| No.13 2014 | Applications of Ag-alloy Stud Bump for IC and LED Packages | IMPACT-EMAP 2014 Joint Conference P.176-P.179 | Hsing-Hua Tsaia, Chih-Hsin Tsai, Jun-Der Lee, Dennis Chang, Yu-Ting Shih , Chun-Hao Chen and Tung-Han Chuang, |
| No.14 2015 | Mechanism of Electromigration in Ag-Alloy Bonding Wires | J. Electron. Mater., 44, 2, (2015) 623-629. | Tung-Han Chuang, Hsin-Jung Lin, Hsi-Ching Wang, Chien-Hsun Chuang, and Chih-Hsin Tsai |
| No.15 2016 | Inhibition of Silver Electrolytic Migration in Ag-alloy Bonding Wires | Materials Science Forum, 863, (2016) 95-101. | Chien-Hsun Chuang, Yan-Cheng Lin, Yu-Zhen He, Chih-Hsin Tsai, Jun-Der Lee, Shang-Chih Wang and Hsing-Hua Tsai |
| No.16 2016 | Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages | IEEE-TCPMT 6,2, (2016) 298-305. | Chih-Hsin Tsai, Chien-Hsun Chuang, Hsing-Hua Tsai, Jun-Der Lee,Dennis Chang, Hsin-Jung Lin, and Tung-Han Chuang |
| No.17 2016 | Low Temperature Bonding of Pd/Ni Assembly for Hydrogen Purifier | Proceedings of the 2nd World Congress on Mechanical, Chemical, and Material Engineering (MCM'16) | Yan-Cheng Lin, Chien-Hsun Chuang, Hsing-Hua Tsai, and Tung-Han Chuang |
| No.18 2016 | Effects of Current Stressing on the Grain Structure and Mechanical Properties of Ag-Alloy Bonding Wi | Metals,6, (2016) 182. | Chien-Hsun Chuang, Chih-Hsin Tsai, Yan-Cheng Lin and Hsin-Jung Lin |
| No.19 2018 | Evaluation of Corrosion Resistance of Ag-Alloy Bonding Wires for Electronic Packaging | IEEE-TCPMT 8,1, (2018) 146-153. | Chun-Hao Chen, Yan-Cheng Lin, Yu-Ting Shih, Sheng-Chi Chen, Chih-Hsin Tsai, Shang-Chih Wang, and Tung-Han Chuang |
| No.20 2018 | Electrolytic Migration of Ag-Pd Alloy Wires with Various Pd Contents | J. Electron. Mater., 47, 7, (2018) 3634-3638. | Yan-Cheng Lin, Chun-Hao Chen, Yu-Zhen He, Sheng-Chi Chen, and Tung-Han Chuang |
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