| Country / Patent No. | Get date | Proprietary name | Inventors |
|---|---|---|---|
| (1) Taiwan TW M374146 |
2010-02-11 | Gas kit for wire bonding machine | JUN-DER LEE、HSING-HUA TSAI |
| (2) Taiwan TW I 323199 |
2010-04-11 | Manufacture method of Ag alloy bonding wire and its product | JUN-DER LEE |
| (3) China CN/ZL2007 1 10176884 6 |
2010-07-07 | Manufacture method of composite metal bonding wire and its product | JUN-DER LEE |
| (4) Taiwan TW I336636 |
2011-02-01 | An ultrasonic cleaning module and a annealing equipment having the ultrasonic cleaning module | JUN-DER LEE、CHIN-SHUI YEH |
| (5) Taiwan TW I 342572 |
2011-05-21 | Manufacture method of composite metal bonding wire and its product | JUN-DER LEE |
| (6) China CN/ZL 2008 1 0094107 1 |
2011-06-29 | Manufacture method of Ag alloy bonding wire and its product | JUN-DER LEE |
| (7) America Patent No.:US8,101,030 B2 |
2012-01-24 | Manufacturing method for composite alloy bonding wire | JUN-DER LEE(TW) |
| (8) America Patent No:US 8,101,123 B2 |
2012-01-24 | Composite alloy bonding wire and manufacturing method thereof | JUN-DER LEE(TW) |
| (9) Taiwan TW I 373382 |
2012-10-01 | Composite alloy bonding wire and its product | JUN-DER LEE |
| (10) Taiwan TW I 384082 |
2013-02-01 | Alloy wire and methods for manufacturing the same | JUN-DER LEE、HSING-HUA TSAI、TUNG-HAN CHUANG |
| (11) Taiwan TW I 394849 |
2013-05-01 | Ag-based alloy wire and method for manufacturing the same | JUN-DER LEE、TUNG-HAN CHUANG、HSING-HUA TSAI |
| (12) Taiwan TW I 395313 |
2013-05-01 | Stud bump structure and method for forming the same | TUNG-HAN CHUANG、HSING-HUA TSAI、JUN-DER LEE |
| (13) Taiwan TW I 396756 |
2013-05-21 | Electronic package alloy wire and methods for manufacturing the same | JUN-DER LEE、TUNG-HAN CHUANG、HSING-HUA TSAI |
| (14) Korea 10-1328863 |
2013-11-06 | Alloy wire and methods for manufacturing the same | HSING-HUA TSAI、JUN-DER LEE、TUNG-HAN CHUANG |
| (15) Japan JP/5541440 |
2014-05-16 | Composite alloy bonding wire and its product | JUN-DER LEE |
| (16) China CN/ZL 2007 1 0307063. 1 |
2014-05-21 | An ultrasonic cleaning module and a annealing equipment having the ultrasonic cleaning module | JUN-DER LEE、CHIN-SHUI YEH |
| (17) America Patent No:US 8,940,403 B2 |
2015-01-27 | Alloy wire and methods for manufacturing the same | HSING-HUA TSAI 、JUN-DER LEE、TUNG-HAN CHUANG、 |
| (18) Japan JP/5670412 |
2015-02-18 | Alloy wire and methods for manufacturing the same | HSING-HUA TSAI 、JUN-DER LEE、TUNG-HAN CHUANG、 |
| (19) China CN/ZL 1670992 |
2015-05-20 | Alloy wire and methods for manufacturing the same | HSING-HUA TSAI 、JUN-DER LEE、TUNG-HAN CHUANG、 |
| (20) Taiwan TW I 486970 |
2015-06-01 | Copper alloy wire and methods for manufacturing the same | HSING-HUA TSAI 、JUN-DER LEE、TUNG-HAN CHUANG、 |
| (21) Korea 10-1528030 |
2015-06-04 | Stud bump structure and method for manufacturing the same | HSING-HUA TSAI 、JUN-DER LEE、TUNG-HAN CHUANG、 |
| (22) Taiwan TW I 538762 |
2016-06-21 | Stud bump and package structure thereof and method of forming the same | HSING-HUA TSAI 、JUN-DER LEE、TUNG-HAN CHUANG |
| (23) America Patent No:US 9,425,168 B2 |
2016-08-23 | Stud bump and package structure thereof and method of forming the same | HSING-HUA TSAI 、JUN-DER LEE、TUNG-HAN CHUANG |
| (24) America Patent No:US 9,425,168 B2 |
2016-08-23 | Stud bump and package structure thereof and method of forming the same | HSING-HUA TSAI 、JUN-DER LEE、TUNG-HAN CHUANG |
| (25) Taiwan TW I 548480 |
2016-09-11 | Copper bonding wire and methods for manufacturing the same | HSING-HUA TSAI 、JUN-DER LEE、TUNG-HAN CHUANG |
| (26) Taiwan TW I 555125 |
2016-10-21 | Method for manufacturing package of power module | HSING-HUA TSAI 、JUN-DER LEE、TUNG-HAN CHUANG |
| (27) America Patent No:US 9,490,147 B2 |
2016-11-08 | Stud bump and package structure thereof and method of forming the same | HSING-HUA TSAI 、JUN-DER LEE、TUNG-HAN CHUANG |
| (28) Taiwan TW I 559417 |
2016-11-21 | Bonding wire for power module package and method of manufacturing the same | HSING-HUA TSAI 、JUN-DER LEE、TUNG-HAN CHUANG |
| (29) Germany DE 10 201300057 B4 |
2016-11-24 | Alloy wire and methods for manufacturing the same | HSING-HUA TSAI 、JUN-DER LEE、TUNG-HAN CHUANG |
| (30) Japan JP/6050308 |
2016-12-02 | Stud bump and package structure thereof and method of forming the same | HSING-HUA TSAI 、JUN-DER LEE、TUNG-HAN CHUANG |
| (31) China CN/ZL 2013 1 0308953. X |
2016-12-28 | Stud bump structure and method of forming the same | HSING-HUA TSAI 、JUN-DER LEE、TUNG-HAN CHUANG |
| (32) Taiwan TW I 567842 |
2017-01-21 | Graphene coated silver alloy wire and methods for manufacturing the same | HSING-HUA TSAI 、CHIEN-HSUN CHUANG |
| (33) Japan JP/6088950 |
2017-03-01 | METHOD OF FORMING PACKAGE STRUCTURE | HSING-HUA TSAI 、JUN-DER LEE、TUNG-HAN CHUANG |
| (34) Taiwan TW I 576933 |
2017-04-01 | METHOD OF FORMING PACKAGE STRUCTURE | HSING-HUA TSAI 、JUN-DER LEE、TUNG-HAN CHUANG |
| (35) Taiwan TW I 580133 |
2017-04-21 | Structure of assembly grasp for palladium-alloy tubes and method for manufacturing the same | HSING-HUA TSAI 、CHIEN-HSUN CHUANG |
| (36) Taiwan TW I 599664 |
2017-09-21 | Metallic ribbon for power module packaging | HSING-HUA TSAI 、CHIEN-HSUN CHUANG、SHANG-CHIH WANG |
| (37) America Patent No:US 9,901,865 B2 |
2017-09-21 | Structure of assembly grasp for palladium-alloy tubes and method for manufacturing the same | HSING-HUA TSAI 、CHIEN-HSUN CHUANG |
| (38) China CN/ZL 2014 1 0133209.5 |
2018-05-18 | Stud bump and package structure thereof and method of forming the same | HSING-HUA TSAI 、JUN-DER LEE、TUNG-HAN CHUANG |
| (39) America Patent No:US 9,997,488 B2 |
2018-06-12 | Copper-based alloy wire and methods for manufacturing the same | HSING-HUA TSAI 、JUN-DER LEE、TUNG-HAN CHUANG |
Taiwan's high-tech industry due to global environmental change and the whole industry into the era of highly competitive and profit of, for the sake of business continuity, will continue to use existing strengths to provide the semiconductor industry better alloy wire, to cope with the grim reality of the production costs challenges and expectations of the staff combined with the centripetal force ...
"Alloy Wire" is mainly composed of different metal composition, physical properties, fracture load, elongation at break, after the wire tension and thrust are better than gold wire, electrical conductivity and fusing current, thermal conductivity can be comparable to gold wire, but the price is significantly lower in gold thread.
Complete specifications alloy wire produced by our company, diameter 2.0 ~ 0.6mil (0.0500-0.0150mm), and can be tailored for client models, has a strong R & D team and production lines and deep technical foundation for backing, you absolutely can meet the needs of production quality and price.
